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Dispensing Valves

TS9000 Series Jet Tech Valve

The TS9000 Series Jet Tech is a Piezoelectric driven, non contact dispense valve capable of handling fluid viscosities to 2 million Cps. Jet Tech offers a fast jetting action producing hundreds of accurate deposits less than one second.
Every component of the valve was designed to the highest tolerances and manufactured to the strictest degree of precision insuring world class accuracy and repeatability in drop-to-drop dispensing volume.
Jet Tech's compact size and modular design aids integration into robotic systems. The valve features fully adjustable parameter settings, allowing the operator to change the jetting properties for different fluid types and optimize the process for repeatable dispensing.
A variety of nozzles shape and sizes along with different tappet configurations provides a wide spectrum of output jet deposits.
 

TS9000 Jet Valve Series



 

  • Features
  • Specifications
  • Applications
  • Non contact Jetting technology
  • Accurate and precise dispensing
  • Extremely high speed, up to 1000Hz
  • Repeatable drop size as small as 2 nl
  • Jet Fluid from 7K to 2 million Cps
  • Small modular design
  • Easy and fast cleaning
  • Field replaceable spare parts
  • Low total cost of ownership

TS9000

Size Valve W x L x H:

4.53” x 1.56” x 0.47” (115mm x 39.5mm x 12mm)

Size Controller W x L x H:

4” x 11.61” x 5.06” (101.6mm x 295mm x 128.4mm)

Weight Valve:

258g

Weight Controller:

1600g

Minimum Shot Size:

2 nl

Viscosity Range:

7K to 2000K Cps

Fluid Pressure Range:

1 to 116 psi(0.1 to 8.0bar)

Nozzle Orifice Diameter Range:

0.0028" to 0.016"(0.07mm to 0.40mm)

Max. Dispensing Frequency:

1000 Hz

Power Connection:

10 sets internally; unlimited externally

Standard Interface:

RS232; 25V/ 5V PLC

Operating Temperature:

10 to 50ºC


The TS9000 Jet Tech can be used in wide range of applications. Some examples of processes and applications are:

  • Jetting silver epoxies for die bonding processes
  • Jetting silicone phosphor in the LED assembly process
  • Jetting under-fill in micro-electronic package applications on PCBA
  • Jetting micro dots of UV adhesive in medical device applications

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