Jet Tech Valve - TS9200D

Jet Tech Valve - TS9200D Series

 
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TS9200D
 
The TS9200D Jet Tech is a non-contact dispense valve capable of jetting fluid viscosities to 400,000 Cps. Jet Tech offers a fast jetting action producing hundreds of precise droplets in less than one second.

The main feature of the valve is a single, easily replaceable diaphragm to eliminate dynamic fluid seals found in other jet valves. No longer is it necessary to disassemble, clean and replace worn seals, which translates into saving time and money. The diaphragm also allows fast cycle rates because of its very small mass. There is no large sliding valve stem that slows down the process. With this novel diaphragm design, the energy needed to eject a drop can be adjusted providing a wider process window.

The TS9200D Series Jet Tech is available in the following configurations:

  • TS9200D-125E Jet Valve EPDM Diaphragm, 125µm Nozzle
  • TS9200D-150E Jet Valve EPDM Diaphragm, 150µm Nozzle
  • TS9200D-200E Jet Valve EPDM Diaphragm, 200µm Nozzle
  • TS9200D-125S Jet Valve Silicone Diaphragm, 125µm Nozzle
  • TS9200D-150S Jet Valve Silicone Diaphragm, 150µm Nozzle
  • TS9200D-200S Jet Valve Silicone Diaphragm, 200µm Nozzle
  • No fluid seals to clean or replace
  • Up to 300 drops/ sec
  • Outstanding repeatabilty
  • Viscosities up to 400K cps
  • Drops as small as 10nl
  • Integral heater with minimal fluid heated
  • Tungsten carbide internal components for long life
  • Quick and simple maintenance

Size Width

50.8mm (2.00")

Size Depth

93.8mm (3.69")

Size Height:

88.9mm (3.50")

Weight:

348g (0.77lb)

Speed:

Up to 300Hz Continuous Duty

Syringe Capacity:

5, 10, 30 and 55cc

Minimum Shot Size:

10nl

Viscosity Range:

1 to 400K Cps.

Fluid Pressure:

40 psi(2.76 bar)

Nozzle Sizes:

100µm, 125µm, 150µm, 200µm

Jet Pressure:

35psi to 70psi (2.41 to 4.8 bar)

Controller Interface:

RS-232 & LCD Display w/ Interface

Input/ Output:

TTL Level Triggers

Operating Temperature:

10 to 50ºC

The TS900D Jet Tech can be used in wide range of applications. Some examples of processes and applications are:

  • Jetting silver epoxies for die bonding processes
  • Jetting silicone phosphor in the LED assembly process
  • Jetting under-fill in micro-electronic package applications on PCBA
  • Jetting micro dots of UV adhesive in medical device applications

Techcon offers a fluid dispensing system that will meet your specific needs. If you need help choosing a system or components or have any questions about our products, please feel free to contact us using the information below.


If you would like to place an order or have questions about your order, please contact our office.


Corporate Headquarters (United States)

OK International/ Techcon Headquarters

10800 Valley View Street
Cypress, CA 90630 
Tel: 1-714-230-2398
Fax: 1-714-230-2393
Email: oemorders@okinternational.com

European Corporate Office

OK International/ Techcon

Eagle Close, Chandler's Ford Industrial Estate, Eastleigh
Hampshire, SO53 4NF, United Kingdom
Tel: English +44 2380 489 100
Tel: Français: +33 176 710 403
Tel: Deutsch: +49 (0)3222 109 1900
Email: Europe-Orders@okinternational.com